April 20, 2017 / 10:57 AM / 4 months ago

BRIEF-Pengqi Technology to issue up to 1.5 bln yuan bonds

April 20 (Reuters) - Pengqi Technology Development Co Ltd

* Says it plans to issue up to 1.5 billion yuan ($217.95 million) bonds

Source text in Chinese: bit.ly/2oYmR39

Further company coverage: ($1 = 6.8822 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

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