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BRIEF-Tecnocom to repay 35 mln euros in bonds due 2019
February 27, 2017 / 12:02 PM / 7 months ago

BRIEF-Tecnocom to repay 35 mln euros in bonds due 2019

Feb 27 (Reuters) - Tecnocom Telecomunicaciones y Energia SA :

* Says to repay 6.5 percent bonds totaling 35 million euros ($37.0 million) with maturity on April 8, 2019

* Says bond repayment at 103.25 percent of the nominal value plus all the interests

Source text for Eikon:

Further company coverage: ($1 = 0.9452 euros) (Gdynia Newsroom)

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