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BRIEF-Union Semiconductor Equipment signs 2.11 bln won contract with Nexchip Semiconductor
March 15, 2017 / 3:15 AM / 6 months ago

BRIEF-Union Semiconductor Equipment signs 2.11 bln won contract with Nexchip Semiconductor

March 15 (Reuters) - Union Semiconductor Equipment Co Ltd :

* Says it signs 2.11 billion won contract with Nexchip Semiconductor Corp to provide semiconductor equipments

Source text in Korean: goo.gl/A7gMpF

Further company coverage: (Beijing Headline News)

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