March 28, 2017 / 11:02 AM / 4 months ago

REFILE-BRIEF-Shanghai Runda Medical Technology to issue up to 1.5 bln yuan bonds

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(Refiles to fix spelling in Source text)

March 28 (Reuters) - Shanghai Runda Medical Technology Co Ltd

* Says it plans to issue up to 1.5 billion yuan ($217.90 million) bonds

Source text in Chinese: bit.ly/2otKs8y

Further company coverage: ($1 = 6.8840 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

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