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BRIEF-Electronics components maker Shenzhen Huakong plans private placement to raise up to 529.1 mln yuan
January 20, 2014 / 10:44 AM / 4 years ago

BRIEF-Electronics components maker Shenzhen Huakong plans private placement to raise up to 529.1 mln yuan

Jan 20 (Reuters) - Shenzhen Huakong Seg Co Ltd

* Says plans to issue up to 110 million shares at 4.81 yuan ($0.8) per share in private placement

Source text in Chinese: link.reuters.com/map26v

Further company coverage: (Reporting by Hong Kong and Singapore newsrooms)

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