Profile: Kinsus Interconnect Technology Corp (3189.TW)

3189.TW on Taiwan Stock Exchange

101.50TWD
19 Dec 2014
Price Change (% chg)

NT$2.10 (+2.11%)
Prev Close
NT$99.40
Open
NT$102.00
Day's High
NT$102.00
Day's Low
NT$100.00
Volume
2,809
Avg. Vol
2,420,561
52-wk High
NT$139.50
52-wk Low
NT$94.30

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Kinsus Interconnect Technology Corp. is a Taiwan-based company principally engaged in the manufacture and distribution of ball grid array (BGA) substrates. The Company’s products portfolio consists of plastic BGA substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates and flip chip CSP substrates, as well as chip on flex (COF), among others. Its products are applied in the manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products, among others. The Company distributes its products in domestic market and to overseas markets.

Company Address

Kinsus Interconnect Technology Corp

No.1245, Junghua Road, Shihlei V
SINWU     327
P: +8863.4871919
F: +8863.4871920

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