February 12, 2018 / 11:39 AM / 5 months ago

BRIEF-China Ludao Technology To Place Bonds In Aggregated Principal Amount Of Up To HK$100 Mln

Feb 12 (Reuters) - China Ludao Technology Co Ltd:

* TO PLACE BONDS IN AN AGGREGATED PRINCIPAL AMOUNT OF UP TO HK$100 MILLION Source text for Eikon: Further company coverage:

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