December 25, 2017 / 12:43 PM / a month ago

BRIEF-China Wafer Level CSP receives government subsidy of 9.2 mln yuan

Dec 25(Reuters) - China Wafer Level CSP Co Ltd

* Says it received government subsidy of 9.2 million yuan recently

Source text in Chinese: goo.gl/jJ73BQ

Further company coverage: (Beijing Headline News)

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