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BRIEF-Foshan Nationstar Optoelectronics to invest in chip packaging project
September 28, 2017 / 9:48 AM / in a month

BRIEF-Foshan Nationstar Optoelectronics to invest in chip packaging project

Sept 28 (Reuters) - Foshan Nationstar Optoelectronics Co Ltd

* Says it signs letter of intent to invest 1.0 billion yuan ($149.95 million) in chip packaging project in Zhejiang province

Source text in Chinese: bit.ly/2wWQCql

Further company coverage: ($1 = 6.6690 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

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