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BRIEF-Foxsemicon Integrated Technology to issue 1st tranche unsecured convertible bonds worth up to T$1.01 bln
November 9, 2017 / 9:02 AM / a month ago

BRIEF-Foxsemicon Integrated Technology to issue 1st tranche unsecured convertible bonds worth up to T$1.01 bln

Nov 9 (Reuters) - Foxsemicon Integrated Technology Inc :

* Says it plans to issue 1st tranche domestic unsecured convertible corporate bonds worth up to T$1.01 billion

* Bonds are each with par value of T$100,000, a term of three years and coupon rate of 0 percent

* Proceeds will be used to supplement working capital

Source text in Chinese: goo.gl/4syTcZ

Further company coverage: (Beijing Headline News)

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