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BRIEF-Qualcomm and Himax Technologies jointly announce high resolution 3D depth sensing solution
August 30, 2017 / 10:07 AM / 3 months ago

BRIEF-Qualcomm and Himax Technologies jointly announce high resolution 3D depth sensing solution

Aug 30 (Reuters) - Himax Technologies Inc

* Qualcomm and Himax Technologies jointly announce high resolution 3D depth sensing solution

* Qualcomm Inc - ‍co and Himax will commercialize SLiM 3D camera as a total camera system solution with mass production targeting in Q1/2018​ Source text for Eikon: Further company coverage:

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