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BRIEF-Semiconductor Manufacturing International Enters Placing Agreement To Place 241.4 Mln Placing Shares
November 29, 2017 / 1:46 AM / 16 days ago

BRIEF-Semiconductor Manufacturing International Enters Placing Agreement To Place 241.4 Mln Placing Shares

Nov 29 (Reuters) - Semiconductor Manufacturing International Corp:

* ENTERS PLACING AGREEMENT TO PLACE 241.4 MILLION PLACING SHARES AT A PRICE OF HK$10.65 PER PLACING SHARE​

* ‍GROSS PROCEEDS OF PLACING WILL BE ABOUT HK$2.57 BILLION & NET PROCEEDS OF PLACING WILL BE ABOUT HK$2.55 BILLION​ ‍​

* ANNOUNCES ‍PROPOSED ISSUE OF US$65 MILLION PERPETUAL SUBORDINATED CONVERTIBLE SECURITIES​ Source text for Eikon: Further company coverage:

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