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BRIEF-Shengyi Technology gets regulatory approval for bond issue
October 10, 2017 / 10:34 AM / 2 months ago

BRIEF-Shengyi Technology gets regulatory approval for bond issue

Oct 10 (Reuters) - Shengyi Technology Co Ltd

* Says it gets securities regulator’s approval to issue 1.8 billion yuan ($273.72 million) convertible bonds

Source text in Chinese: bit.ly/2gsbGLd

Further company coverage: ($1 = 6.5760 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

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