Reuters logo
BRIEF-Tianjin Zhonghuan Semiconductor's H1 profit up, plans bond issue
August 24, 2017 / 9:24 AM / a month ago

BRIEF-Tianjin Zhonghuan Semiconductor's H1 profit up, plans bond issue

Aug 24 (Reuters) - Tianjin Zhonghuan Semiconductor Co Ltd

* Says it plans to issue up to 3.0 billion yuan ($450.45 million) bonds

* Says H1 net profit up 9.3 percent y/y at 274.1 million yuan

* Says it plans to boost tech unit’s registered capital by 349.5 million yuan to 619.5 million yuan

Source text in Chinese: bit.ly/2w08FJV; bit.ly/2wHLmp1; bit.ly/2xfa5if

Further company coverage: ($1 = 6.6600 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

Our Standards:The Thomson Reuters Trust Principles.
0 : 0
  • narrow-browser-and-phone
  • medium-browser-and-portrait-tablet
  • landscape-tablet
  • medium-wide-browser
  • wide-browser-and-larger
  • medium-browser-and-landscape-tablet
  • medium-wide-browser-and-larger
  • above-phone
  • portrait-tablet-and-above
  • above-portrait-tablet
  • landscape-tablet-and-above
  • landscape-tablet-and-medium-wide-browser
  • portrait-tablet-and-below
  • landscape-tablet-and-below