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BRIEF-Shenzhen Tianyuan gets regulatory approval for bonds issue
December 25, 2015 / 12:15 PM / 2 years ago

BRIEF-Shenzhen Tianyuan gets regulatory approval for bonds issue

Dec 25 (Reuters) - Shenzhen Tianyuan Dic Information Technology Co Ltd

* Says gets securities regulator’s approval for for up to 400 million yuan ($61.78 million) bonds issue

Source text in Chinese: bit.ly/1mit4ly

Further company coverage: ($1 = 6.4748 Chinese yuan renminbi) (Reporting by Hong Kong and Singapore newsrooms)

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