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BRIEF-Suzhou New District Hi Tech to issue up to 5 bln yuan debt financing instruments
December 20, 2016 / 8:15 AM / a year ago

BRIEF-Suzhou New District Hi Tech to issue up to 5 bln yuan debt financing instruments

Dec 20 (Reuters) - Suzhou New District Hi Tech Industrial Co Ltd

* Says it plans to issue up to 5.0 billion yuan ($719.34 million) debt financing instruments

Source text in Chinese: bit.ly/2i41dYv

Further company coverage: ($1 = 6.9508 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

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