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BRIEF-Advanced Semiconductor Engineering updates on T$8 bln corporate bonds issuance
January 4, 2017 / 9:45 AM / in a year

BRIEF-Advanced Semiconductor Engineering updates on T$8 bln corporate bonds issuance

Jan 4 (Reuters) - Advanced Semiconductor Engineering Inc :

* Says co will issue the first series domestic unsecured corporate bonds for 2016, worth totaling T$8 billion, on Jan. 13, composed of T$3.7 billion 5-yr bond A and T$4.3 billion 7-yr bond B

* Par value and issue price of T$1 million for the bonds

* Interest rate at 1.25 percent for bond A, 1.45 percent for bond B

* Proceeds to be used for loan repayment

Source text in Chinese: goo.gl/9btuQ7

Further company coverage: (Beijing Headline News)

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