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BRIEF-Suzhou New District Hi-Tech plans to issue up to 700 mln yuan bonds
June 3, 2014 / 7:53 AM / 4 years ago

BRIEF-Suzhou New District Hi-Tech plans to issue up to 700 mln yuan bonds

June 3 (Reuters) - Suzhou New District Hi Tech Industrial Co Ltd

* Says plans to issue up to 700 million yuan ($112.05 million)corporate bonds

Source text in Chinese: link.reuters.com/but79v

Further company coverage: ($1 = 6.2473 Chinese Yuan Renminbi) (Reporting by Hong Kong and Singapore newsrooms)

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