Profile: ACM Research Inc (ACMR.OQ)
16 Sep 2019
Acm Research, Inc., incorporated on September 27, 2017, develops, manufactures and sells single-wafer wet cleaning equipment, which semiconductor manufacturers uses in manufacturing steps to remove particles, contaminants and other random defects in fabricating integrated circuits, or chips. The Company’s Ultra C equipment is designed to remove random defects from a wafer surface, even at an advanced process node (the minimum line width on a chip) of 22 nanometers (nm) or less. Its equipment is based on its Space Alternated Phase Shift (SAPS) and Timely Energized Bubble Oscillation (TEBO) technologies. Its SAPS technology uses alternating phases of megasonic waves to deliver megasonic energy to flat and patterned wafer surfaces in a highly uniform manner on a microscopic level. Its TEBO technology provides cleaning for both conventional two-dimensional (2D) and three-dimensional (3D) patterned wafers at advanced process nodes.
The Company also offers a range of custom-made equipment, such as cleaners, coaters, developers, photoresist strippers, wet etchers and copper-plating tools, to back-end wafer assembly and packaging factories. Its SAPS megasonic cleaning technology can be applied during the chip fabrication process to clean wafer surfaces and interconnects. It offer two models of wet wafer cleaning equipment based on its SAPS technology, Ultra C SAPS II and Ultra C SAPS V. TEBO applications include memory chips and logic chips. It offers two models of wet wafer cleaning equipment based on its TEBO technology, Ultra C TEBO II and Ultra C TEBO V.
The Company competes with Lam Research Corp., DNS Electronics LLC, Tokyo Electron Ltd., SEMES Co. Ltd., Mujin Electronics Co., Ltd. and Beijing Sevenstar Science & Technology Co., Ltd.
ACM Research Inc
42307 Osgood Rd Ste I
FREMONT CA 94539-5062